
- 封裝名稱:C-Bend Lead
- 封裝簡介:C-Bend Lead

- 封裝名稱:CERQUAD
- 封裝簡介:Ceramic Quad Flat Pack
- 詳細規格

- 封裝名稱:CLCC
- 封裝簡介:CLCC
- 詳細規格

- 封裝名稱:CNR
- 封裝簡介:Communication and Networking Riser Specification Revision 1.2
- 詳細規格

- 封裝名稱:CPGA
- 封裝簡介:Ceramic Pin Grid Array

- 封裝名稱:Ceramic Case
- 封裝簡介:Ceramic Case

- 封裝名稱:LAMINATE CSP 112L
- 封裝簡介:Chip Scale Package
- 詳細規格